METHOD AND NOZZLE FOR APPLYING BONDING AGENT FOR CONNECTING PARTS TO CARRIER AND CIRCUIT BASE PLATE COATED WITH BONDING AGENT

摘要

PURPOSE: To apply a solder paste and conductive bonding agent, etc., on the chip on a chip carrier, in the manufacturing process of electronic circuits by providing a permanent mask having a cavity opening at a conductive pad part on a carrier, moving an injection head on the surface of mask, and packing a bonding agent in the cavity opening under pressure. CONSTITUTION: A solder mask 12 is of a photosensitive epoxy composition, wherein a cavity or a blend hole 13 is formed by development and etching, and a chip pad wring 11 is exposed for connection. A solder paste injection head 14 is lowered until the surface of a nozzle 21 contacts the mask 12. A slight force is applied downwards to keep the state where a valve surface 16 makes a tightly contact to a mask surface, then a pressure is applied to a solid paste 15. The injection head 14 traversed over to a chip site, and cavity of a pad or a blind hole 13 is packed with a solder paste, then the solder paste is allowed to contact a chip pad wiring. The injection head makes a tight contact with a solder mask surface.