HEAT-RESISTANT THERMOSETTING RESIN COMPOSITION, ADHESIVE SHEET, ADHESIVE-BACKED POLYIMIDE FILM, AND METAL-FOIL-CLAD POLYIMIDE FILM

摘要

PURPOSE: To obtain a resin composition which cures at a low temp. to give a cured adhesive layer with good heat resistance and is useful as a heat-resistant adhesive by mixing a specific polyimide with a specific polymaleimide and an epoxy resin. ;CONSTITUTION: A polyimide containing units represented by formula I [wherein 1-40wt.% of the Ar's are represented by formula II (where R is a divalent hydrocarbon residue; R₁ to R₄ each is a lower alkyl or phenyl; and (l) is 5-30) and 99-60mol% thereof are represented by formula III (where Z is C(=O), SO₂, O, S, (CH₂)_m, NHC(=O), C(CH₃)₂, etc.; (n) and (m) each is an integer of 1 or larger; and the benzene rings are optionally substituted) or formula IV (where R₅ to R₈ each is H, a 1-4C alkyl, or an alkoxy and X is CH₂, C(CH₃)₂, O, SO₂, etc.)] is mixed with a polymaleimide represented by formula V (wherein k2 and R₉ is a 2C or higher group having a valence of (k)) and an epoxy resin to obtain the objective composition. This composition can cure at 180C or lower to give a cured adhesive layer with good heat resistance. It is useful as a heat-resistant adhesive for use in producing a flexible printed circuit board or a thin laminate.;COPYRIGHT: (C)1994,JPO