THERMOSETTING RESIN COMPOSITION, ADHESIVE SHEET, POLYIMIDE FILM HAVING ADHESIVE AND METAL FOIL LAMINATED POLYIMIDE FILM

摘要

PURPOSE:To obtain a composition capable of bonding and curing at low temperature, having good heat resistance and used as a heat resistant adhesive useful for flexible printed-wiring board substrates, thin film multilayered substrates, etc., by including a specific polyimide and epoxy resin. CONSTITUTION:The composition is obtained by blending a polyimide containing a structural unit of formula I [X is O or C(=O)O; Ar1 is divalent group containing aromatic ring; Ar2 is composed of 10-90mol group of formula II (Z is SO2, NHCO, O, etc.; K is 0 or 1; H of each benzene ring may be substituted with a substituent group) and 90-10mol% group of formula III (R1 to R4 are H, 1-4C alkyl or alkoxy and $ 2 groups thereof are alkoxy or alkyl; X' is CH2, O, etc.)] with 10-50wt.% (preferably 25-40wt.%) epoxy resin and as necessary, polymaleimide, etc. Furthermore, polyimide of formula I is obtained by reacting an acid dianhydride of formula IV with a compound of formula V [Y is amino or isocyanate; (m) is 1-4] and a compound of formula VI.