首页> 外国专利> ONE-PART SOLVENTLESS CONFORMAL COATING

ONE-PART SOLVENTLESS CONFORMAL COATING

机译:一站式无溶剂保形涂层

摘要

PURPOSE: To obtain a one-part solventless conformal coating compsn. suitable for coating printed circuits by compounding a diorganovinyl-endblocked polydiorganosiloxane, an organosiloxane acting as a crosslinker, a platinum catalyst, etc. ;CONSTITUTION: (A) a diorganovinyl-endblocked polydiorganosiloxane having 6C or lower hydrocarbon or fluoroalkyl groups as org. groups and a viscosity (25°C) of 0.3-1 Pa.s, (B) an organosilicon compd. which has, on average, at least 3 Si-bonded hydrogen atoms and in which Si atoms not bonded to hydrogen atoms are bonded to oxygen atoms and/or the above-mentioned org. groups, (C) a platinum catalyst (e.g. chloroplatinic acid), (D) a polysiloxane having Si-bonded hydroxyl groups, Si-bonded vinyl groups, siloxane units, and 15 or less silicon atoms bonded to alkyl groups, etc., or to oxygen atoms, (E) a silane having an epoxy-contg. org. group, and (F) an acetylenic alcohol are compounded in a specified ratio.;COPYRIGHT: (C)1995,JPO
机译:目的:获得一种无溶剂的保形涂料组分。适用于通过混合二有机基乙烯基封端的聚二有机硅氧烷,用作交联剂的有机硅氧烷,铂催化剂等来涂覆印刷电路;组成:(A)具有6C或以下烃或氟烷基的有机基二有机基末端封端的聚二有机硅氧烷。基团和粘度(25℃)为0.3-1Pa.s,(B)有机硅化合物。其平均具有至少3个与硅键合的氢原子,并且其中未与氢原子键合的Si原子与氧原子和/或上述有机基键合。基团;(C)铂催化剂(例如氯铂酸),(D)具有与硅键合的羟基,与硅键合的乙烯基,硅氧烷单元以及与烷基键合的硅原子数为15个以下的硅原子的聚硅氧烷等,或对于氧原子,(E)具有环氧基的硅烷。 org。 (F)炔醇按指定比例混合。版权所有:(C)1995,JPO

著录项

  • 公开/公告号JPH07166066A

    专利类型

  • 公开/公告日1995-06-27

    原文格式PDF

  • 申请/专利权人 DOW CORNING CORP;

    申请/专利号JP19920102560

  • 发明设计人 VANWERT BERNARD;HOUGHTALING DAWN MARIE;

    申请日1992-04-22

  • 分类号C08L83/07;C08K5/05;C08K5/54;C08L83/05;C09D183/07;

  • 国家 JP

  • 入库时间 2022-08-22 04:22:04

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号