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A new compound with room temperature electrical resistivity comparable to that of elemental copper

机译:一种新型室温电阻率可与元素铜媲美的化合物

摘要

The present invention relates to novel compounds that exhibit unusually low electrical resistivity at room temperature. More specifically, it has been discovered that the incorporation of at least 1 to 15 atomic percent of gallium and/or at least 1 to 15 atomic percent gold into stoichiometric copper germanide (Cu₃Ge) compound results in a room temperature resistivity comparable to elemental copper, but with superior chemical and electronic stability upon exposure to air or oxygen at high temperatures. Furthermore, the compounds of the present invention have none of the problems associated with the diffusion of copper into elemental and compound semiconductors which oftentimes lead to the degradation of the semiconductor device characteristics. Additionally, the present invention relates to a method of preparing the novel compounds mentioned previously hereinabove.
机译:本发明涉及在室温下表现出异常低电阻率的新型化合物。更具体地说,已发现将至少1至15原子%的镓和/或至少1至15原子%的金掺入化学计量的锗化铜(Cu)Ge)化合物中,可得到与元素铜相当的室温电阻率,但在高温下暴露于空气或氧气中时具有出色的化学和电子稳定性。此外,本发明的化合物不存在与铜扩散到元素半导体和化合物半导体中相关的问题,这通常会导致半导体器件特性的下降。另外,本发明涉及制备上文提及的新型化合物的方法。

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