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POLYMERIC SUBSTRATE WITH POLYMERIC MICROELEMENTS brbrbr Patents-stay tuned to the technology POLYMERIC SUBSTRATE WITH POLYMERIC MICROELEMENTS
POLYMERIC SUBSTRATE WITH POLYMERIC MICROELEMENTS brbrbr Patents-stay tuned to the technology POLYMERIC SUBSTRATE WITH POLYMERIC MICROELEMENTS
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机译:具有聚合物微元素的聚合物基体 保持对技术的专利-带有聚合物微元素的聚合物基体
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摘要
The present invention relates to a product or a polishing pad (10) for deforming a surface of a workpiece (e.g., polishing or planarizing a semiconductor device). The article comprises a polymeric matrix (14) filled with a plurality of polymeric microelements (16) having voids therein. The product has a working surface (18) and an inner layer surface adjacent thereto. When the product is in contact with the processing environment, the hardness of the polymeric microelements at the working surface of the article is lower than the hardness of the polymeric particles encapsulated in the inner layer surface. If the working surface of the product is worn during use, the working surface of the pad is continuously regenerated. In another preferred embodiment, the machined surface can be further minitectic and / or macro-textured.
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