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niedrigschmelzendes kupferdotiertes weichlot for assembly and wiedermontage of components.
niedrigschmelzendes kupferdotiertes weichlot for assembly and wiedermontage of components.
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机译:低熔点,掺杂铜的软焊料,用于组件的组装和重新组装。
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摘要
Low melting temperature copper-containing solders are disclosed for soldering and rework on copper surfaces. The amount of copper required in the solder in order to inhibit dissolution of the copper surface to be soldered has been found to be dopant level, below the binary tin-copper eutectic point.
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