首页>
外国专利>
Low-melting copper-doped soft solder for mounting and reinstallation of components.
Low-melting copper-doped soft solder for mounting and reinstallation of components.
展开▼
机译:低熔点掺杂铜的软焊料,用于安装和重新安装组件。
展开▼
页面导航
摘要
著录项
相似文献
摘要
Low melting temperature copper-containing solders are disclosed for soldering and rework on copper surfaces. The amount of copper required in the solder in order to inhibit dissolution of the copper surface to be soldered has been found to be dopant level, below the binary tin-copper eutectic point.
展开▼