首页> 外国专利> Process for the production of a semiconductor laser with a buried strip structure using dry kits for the production of this strip and a laser produced according to this process.

Process for the production of a semiconductor laser with a buried strip structure using dry kits for the production of this strip and a laser produced according to this process.

机译:使用干燥套件生产具有埋入式条带结构的半导体激光器的方法,该干燥套件用于生产该条带和根据该方法生产的激光器。

摘要

According to this method, a heterostructure is formed by a first epitaxial growth during which a confinement layer (22) having a first type of doping, an active layer (24) and a protective layer (28) are deposited on a substrate (20), the protective layer and the active layer are etched by a technique of reactive ion beam etching by means of a gaseous mixture of argon, methane and hydrogen, down to the confinement layer, so as to form a strip (32) starting from the active layer, and the strip is buried, by a second epitaxial growth, in a semiconductor layer (36) having a second type of doping opposite to the first. …??Application to optical telecommunications. …IMAGE…
机译:根据该方法,通过第一外延生长形成异质结构,在此期间,在基板(20)上沉积具有第一类型的掺杂的限制层(22),有源层(24)和保护层(28)。然后,通过反应性离子束蚀刻技术,借助于氩气,甲烷和氢气的气态混合物,蚀刻保护层和活性层,直到限制层,从而从活性层开始形成条带(32)然后,通过第二外延生长,将条带掩埋在具有与第一掺杂相反的第二掺杂类型的半导体层(36)中。 …在光通信中的应用。 …<图像>…

著录项

  • 公开/公告号DE69201251D1

    专利类型

  • 公开/公告日1995-03-09

    原文格式PDF

  • 申请/专利权人 FRANCE TELECOM PARIS FR;

    申请/专利号DE19926001251T

  • 发明设计人 BOUADMA NOUREDINE F-94250 GENTILLY FR;

    申请日1992-02-24

  • 分类号H01S3/19;H01L33/00;

  • 国家 DE

  • 入库时间 2022-08-22 04:07:48

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