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Scheme for bath chemistry measurement and control for improved semiconductor wet processing

机译:用于改进半导体湿法工艺的镀液化学测量和控制方案

摘要

A feedback control system for providing automated and in-situ control of multi-component chemical concentrations in a liquid bath used for semiconductor processing. A sample from the liquid bath is injected into a carrier stream and routed to a conductivity detector and to an amperometric detector. Hydrogen peroxide concentration levels, as well as acidic or basic component concentration levels, are monitored and the measured readings are sent to a processor. If the concentration levels are not within tolerance for a given process, the processor meters in an appropriate amount of a needed chemical or diluting agent in order to bring the bath to an appropriate chemical concentration level. Additional detectors are employed in order to provide other types of analyses of the chemicals or contaminants present in the liquid bath and the amperometric detection need not be necessarily limited to H.sub.2 O.sub.2.
机译:一种反馈控制系统,用于自动和原位控制用于半导体加工的液浴中多组分化学物质的浓度。来自液浴的样品被注入载流中,并被引导至电导检测器和安培检测器。监测过氧化氢浓度水平以及酸性或碱性成分浓度水平,并将测得的读数发送至处理器。如果浓度水平不在给定过程的公差范围内,则处理器会计量加入适量的所需化学或稀释剂,以使镀液达到适当的化学浓度水平。为了提供对液体浴中存在的化学物质或污染物的其他类型的分析,采用了附加的检测器,并且安培检测不必一定限于H.sub.O.sub.2。

著录项

  • 公开/公告号US5364510A

    专利类型

  • 公开/公告日1994-11-15

    原文格式PDF

  • 申请/专利权人 SEMATECH INC.;

    申请/专利号US19930017224

  • 发明设计人 RONALD A. CARPIO;

    申请日1993-02-12

  • 分类号G01N27/26;

  • 国家 US

  • 入库时间 2022-08-22 04:05:56

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