Application specific integrated circuit and placement and routing software with non-customizable first metal layer and vias and customizable second metal grid pattern

摘要

An embodiment of the present invention is a customizable integrated circuit including a basic cell diffusion of four transistors in a substrate. A first metallization layer includes a plurality of connective strips that electrically connect to the basic cell by a plurality of contacts. A second metallization layer, after a first patterning and chemical etch, comprises an orthogonal matrix of conductors that are electrically connected to corresponding connective strips by a plurality of vias that are respectively positioned at an intersection of orthogonal conductors. A second patterning and chemical etch of the second metallization layer configures the basic cell according to a user's specification.