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High power dissipation vertical mounted package for surface mount application
High power dissipation vertical mounted package for surface mount application
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机译:高功耗垂直安装封装,适合表面安装应用
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摘要
A mounting device (170) of a semiconductor integrated circuit (202) allows edge mounting on surface of a printed circuit board (250). The mounting device includes a top portion (150) to provide for cooling and protection of the semiconductor chip while a side portion (140) provides for cooling and positioning on the printed circuit board.
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