Metal lead-film carrier assembly having a plurality of film carriers, and film carrier-semiconductor chip assembly and semiconductor device containing such metal lead-film carrier assembly

摘要

A method of assembling a semiconductor chip on a tape carrier has the steps of stacking, on a film carrier having a first group of metal leads, another film carrier having a second group of metal leads and bonding the two film carriers together by adhesive to form a laminated structure. The first and second groups of metal leads are so disposed that they do not contact and do not cross one another. The tips of the metal leads of the two groups are bonded to the electrodes on the semiconductor chip. The metal leads are formed in advance on the corresponding film carriers by etching. By stacking the plurality of film carriers, the connection pitch can be reduced while eliminating a necessity for reducing the thickness of each lead.