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Semiconductor module with a plurality of power devices mounted on a support base with an improved heat sink/insulation plate arrangement
Semiconductor module with a plurality of power devices mounted on a support base with an improved heat sink/insulation plate arrangement
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机译:具有多个功率器件的半导体模块,该功率模块安装在具有改进的散热片/隔热板结构的支撑基座上
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摘要
A semiconductor module having heat sink plates and an insulating plate laminated under the semiconductor chips, wherein the thickness of the support base plate is set to be 2.5 times in thickness of the insulating plate, which is the maximum thickness among the heat sink plates and the insulating plate laminated in the semiconductor module, so that the thermal fatigue lives of the solder layers are balanced, and the life of the whole semiconductor module can be prolonged.
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