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Low temperature co-fired ceramic (LTCC) high density interconnect package with circuitry within the cavity walls
Low temperature co-fired ceramic (LTCC) high density interconnect package with circuitry within the cavity walls
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机译:低温共烧陶瓷(LTCC)高密度互连封装,腔壁内具有电路
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摘要
A unitized integrally fused multilayer circuit package having a substrate, walls disposed on the substrate to form a central circuit package cavity, and circuit traces contained in the walls.
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