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MICROCAPSULE CONTAINING ANTIOXIDANT, ANTIOXIDATION MEMBER CONTAINING THIS MICROCAPSULE AND SOLDERING METHOD USING THIS MICROCAPSULE

机译:包含抗氧化剂的微胶囊,包含该微胶囊的抗氧化剂成员以及使用该微胶囊的焊接方法

摘要

PURPOSE: To make it possible to form a nonoxidizing atmosphere for soldering purposes. ;CONSTITUTION: Microcapsules 1 are incorporated into a flux 4 stored in a flux tank 3. An inert gas is sealed in these microcapsules 1. The flux 4 into which the microcapsules 1 are incorporated adhere to the prescribed points of a printed wiring board 5 passing the flux tank 3. The shells of the microcapsules 1 which come into contact with molten solder 7 are melted and deformed and the inert gas is released when the printed wiring board is moved to a soldering stage in this state. Consequently, the nonoxidizing atmosphere 8 is formed and the good soldering is executed in the atmosphere.;COPYRIGHT: (C)1996,JPO
机译:目的:为了形成一种非氧化性气氛,以进行焊接。 ;组成:将微胶囊1掺入储存在焊剂罐3中的焊剂4中。将惰性气体密封在这些微胶囊1中。掺入有微胶囊1的焊剂4附着在通过印刷电路板5的指定点当印刷线路板在这种状态下移动到焊接台时,与熔融焊料7接触的微囊1的壳熔融变形,并且释放惰性气体。因此,形成了非氧化性气氛8,并在该气氛中进行了良好的焊接。;版权所有:(C)1996,日本特许厅

著录项

  • 公开/公告号JPH08267281A

    专利类型

  • 公开/公告日1996-10-15

    原文格式PDF

  • 申请/专利权人 FUJI XEROX CO LTD;

    申请/专利号JP19950095907

  • 发明设计人 KIMURA AKIFUMI;

    申请日1995-03-30

  • 分类号B23K35/363;B23K31/02;B23K35/22;H05K3/34;

  • 国家 JP

  • 入库时间 2022-08-22 04:03:51

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