PREVENTIVE METHOD FOR SOLDER BRIDGE, FORMING METHOD OF SOLDER BRIDGE PREVENTIVE DAM, SOLDER RESIST MATERIAL AND PRINTED CIRCUIT BOARD

摘要

PURPOSE: To prevent a solder bridge in a step for mounting a surface mounting part, by forming a solder-bridge preventive dam using a solder resist material made of ultraviolet-setting resin with viscosity and a viscosity ratio more than a given value. ;CONSTITUTION: A solder bridge preventive dam made of ultraviolet-setting resin that has viscosity of 1000 poises or above between patterns and a viscosity ratio of 3.0 or above in a printed circuit board manufacturing step. The ultraviolet-setting resin may be formed using a resin compound including photo- reaction initiator and thixotropic modifier. In the ultraviolet-setting resin, on the basis of 100 weight parts of regular resin compound, reactive diluent is 0 to 10 parts, the photo-reaction initiator is 5 to 100 parts, colorant is 0.1 to 10 parts, antifoamer is 0.1 to 10 parts, and interfacial active agent is 0.1 to 10 parts by weight.;COPYRIGHT: (C)1996,JPO