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METHOD FOR SHORTENING INITIATION TIME FOR ELECTROLESS BATH

机译:缩短无电浴启动时间的方法

摘要

PROBLEM TO BE SOLVED: To generate catalytic islands around a small granular metal oxide and to form a sufficient quantity of solid copper thereon by a method, wherein a conductor, a via or a pad exposes a resin and a small granular metal oxide on the surface thereof at a required part, before a circuit board is immersed into a reducing solution. ;SOLUTION: A two derivative continuous processing board is reduced for 5 min in a solution of 1.0 mol. hydrogenated boron and 0.25 mol. EDTA. The substrate is then cleaned with deionized water and immersed into ion palladium solution for 10 seconds. Subsequently, it is cleaned with deionized water and left as it is for 2 minutes in an electroless bath. According to the method, the deriving time is shortened, while increasing the density at the bonding part and the size of copper particle plating the conductors, pads and vias on a circuit board can be reduced.;COPYRIGHT: (C)1996,JPO
机译:解决的问题:通过以下方法在小颗粒的金属氧化物周围产生催化岛并在其上形成足够量的固态铜,其中导体,通孔或焊盘在表面上暴露出树脂和小颗粒的金属氧化物在将电路板浸入还原溶液中之前,将其在所需的部分上。 ;解决方案:在1.0 mol的溶液中将二阶导数连续处理板还原5分钟。氢化硼和0.25摩尔。 EDTA。然后将基板用去离子水清洗,并浸入离子钯溶液中10秒钟。随后,将其用去离子水清洗,并在无电浴中原样放置2分钟。根据该方法,缩短了派生时间,同时增加了接合部分的密度,并减小了在电路板上电镀导体,焊盘和过孔的铜颗粒的尺寸。;版权所有:(C)1996,日本特许厅

著录项

  • 公开/公告号JPH08213738A

    专利类型

  • 公开/公告日1996-08-20

    原文格式PDF

  • 申请/专利权人 MOTOROLA INC;

    申请/专利号JP19950298869

  • 申请日1995-10-24

  • 分类号H05K3/18;C23C18/18;

  • 国家 JP

  • 入库时间 2022-08-22 04:03:06

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