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Focus evaluation pattern and focus evaluation method
Focus evaluation pattern and focus evaluation method
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机译:焦点评估模式和焦点评估方法
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摘要
The pattern is transferred onto the wafer at various wafer locations, and the pattern dimension is measured using a reticle having a fine pattern of less than the resolution limit of the stepper or a separation of fine patterns with a distance separated from the resolution limit Thus, it is possible to easily determine the position of the wafer focus (focus position).
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