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HIGHLY HEAT-CONDUCTIVE COMPOSITE FILLER AND HIGHLY HEAT-CONDUCTIVE RESIN COMPOSITION

机译:高导热复合填料和高导热树脂组合物

摘要

PURPOSE: To obtain a highly heat-conductive composite filler improved in heat conductivity and electrical insulation properties by coating a highly heat- conductive material comprising a metal and/or carbon with an electrical heat- insulation coating film. CONSTITUTION: This filler is obtained by coating the surface of a highly heat- conductive material selected from carbon and at least one metal selected from among the metals belonging to groups 4-6 and periods of 4-6, the elements belonging to groups 13 and 14 and periods of 2 and 3 (according to the 1989 IUPAC Rules), Mg, Fe and Pb and an alloy of at least two of them and having a mean particle diameter of 0.05-200μm, an aspect ratio of 3 or above and a heat conductivity of 60-200w/(m.k) with an electrical insulation material having a volume resistivity of 1013 Ω/cm or above. 100 pts.wt. resin is mixed with 5-900 pts.wt. above filler to obtain a highly heat-conductive resin composition having a heat conductivity of 5w/m.k or above.
机译:用途:通过在电绝缘涂膜上涂覆包含金属和/或碳的高导热材料,获得导热性和电绝缘性能得到改善的高导热复合填料。组成:这种填料是通过涂覆一种高导热材料的表面而获得的,该材料选自碳和至少一种金属,该金属选自4-6族和4-6族的金属,13族和13族的元素。 14,周期2和3(根据1989年IUPAC规则),Mg,Fe和Pb以及其中至少两种的合金,平均粒径为0.05-200μm,长径比为3或更高,且导热系数为60-200w /(mk),且电绝缘材料的体积电阻率为10 13Ω/ cm或更高。 100磅将树脂与5-900 pts.wt.混合。用上述填料获得具有5w / m.k或更高的导热率的高导热性树脂组合物。

著录项

  • 公开/公告号JPH08183875A

    专利类型

  • 公开/公告日1996-07-16

    原文格式PDF

  • 申请/专利权人 OTSUKA CHEM CO LTD;

    申请/专利号JP19940339672

  • 发明设计人 NAKAO RYUJI;KAKOMOTO AYUMI;

    申请日1994-12-28

  • 分类号C08K3/00;C08K7/02;C08K9/04;C08L101/00;C09D201/00;H01B3/02;

  • 国家 JP

  • 入库时间 2022-08-22 04:02:44

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