APPARATUS FOR REMOVING PARTICLES ON FACE OF SEMICONDUCTOR WAFER AND METHOD OF REMOVING PARTICLES ON FACE OF SEMICONDUCTOR WAFER USING THE SAME

摘要

PURPOSE: To provide a removal apparatus for removing particles on the face of a semiconductor wafer, by evacuation can be achieved completely without reattachment of removed particles and to provide a method of removing the particles on the face of the wafer, which uses it. ;CONSTITUTION: In an apparatus for removing particles on the face of a semiconductor wafer 1, a gas discharge means in which all tips of nozzles 3 are bent to the same direction, by which an inert gas is discharged, at an angle, to the face of the semiconductor wafer 1 to be set and in which all the nozzles 3 are housed inside the setting region of the semiconductor wafer 1 and an exhausting trap 5 which generates the laminar flow of a side flow on the semiconductor wafer 1 and in which an intake port 5a is arranged so as to correspond to the direction of the laminar flow are installed.;COPYRIGHT: (C)1996,JPO