首页> 外国专利> ELECTROPOLISHING METHOD OF COPPER AND COPPER ALLOY MADE LEAD FRAME

ELECTROPOLISHING METHOD OF COPPER AND COPPER ALLOY MADE LEAD FRAME

机译:铜及铜合金铅制框架的电解抛光方法

摘要

PURPOSE: To provide an electropolishing method for electropolishing a copper or a copper alloy made lead frame so as to directly silver its surface. ;CONSTITUTION: A copper or copper alloy made lead frame is electropolished by using a noncontact type electropolishing device, electropolishing liquid which contains 20-40g/l sulfuric acid, 40-80g/l NH4Cl and 0.08-0.25g/l nonionic surface active agent at temp. of 40-50°C and DC current having a ripple frequency of 40-120Hz. At this time, the lead frame is electropolished such that alternately at a positive electrode side and a negative electrode side, time that the lead frame acts as the positive electrode is 3.3 times or more than time that the lead frame acts as the negative electrode and current density is 1.0-3.0A/dm2.;COPYRIGHT: (C)1996,JPO
机译:目的:提供一种电抛光方法,用于对铜或铜合金制成的引线框架进行电抛光,以便直接对其表面进行镀银。 ;构成:使用非接触式电抛光装置对铜或铜合金制的引线框架进行电抛光,该电抛光液包含20-40g / l硫酸,40-80g / l NH 4 Cl和0.08在温度下为-0.25g / l非离子表面活性剂。 40-50°C的直流电和纹波频率为40-120Hz的直流电。此时,对引线框架进行电抛光,使得在正极侧和负极侧交替进行,引线框架作为正极的时间是引线框架作为负极的时间的3.3倍以上。电流密度为1.0-3.0A / dm 2 .; COPYRIGHT:(C)1996,JPO

著录项

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号