(57) Abstract The computer module (54) where lamination of IC memory tip/chip adhesion mutually is locked to the microprocessor tip/chip (48) is disclosed. The memory which is offered by the said lamination is dedication in the microprocessor tip/chip. The microprocessor and the memory lamination junction structurally, offer computer moshiyuru which becomes united. Several structural combination examples which include the manner directly junction lamination to the microprocessor and the manner junction lamination and the microprocessor on opposite side of the substrate are disclosed. Electric joint is executed by the manner soldered the bump for the solder which is registered in several layouts namely bump for the solder and between the terminals (46) which are exposed the manner etc which joints at the wire bond (52). Structural junction is executed for example by the adhesive and several manners which use the bump for the solder.
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