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High-frequency AC electric energy - a relatively low frequency alternating current electrical energy - a system and method for having to process the workpiece and

机译:高频交流电能-一种相对低频的交流电能-一种必须处理工件和工件的系统和方法

摘要

A plasma reactor (10) preferably uses a split electrode (26) which surrounds a plasma dome (17) region of the reactor, is driven by high frequency energy selected from VHF and UHF and produces an electric field inside the reactor, parallel to the wafer support electrode (32c). A static axial magnetic field may be used which is perpendicular to the electric field. The above apparatus generates a high density, low energy plasma inside a vacuum chamber (16) for etching metals, dielectrics and semiconductor materials. Relatively lower frequency, preferably RF frequency, auxiliary bias energy applied to the wafer support cathode (32c) controls the cathode sheath voltage and controls the ion energy independent of density. Various etch processes, deposition processes and combined etch/deposition processes (for example, sputter/facet deposition) are disclosed. The triode (VHF/UHF split electrode plus RF wafer support electrode) provides processing of sensitive devices without damage and without microloading, thus providing increased yields. IMAGE
机译:等离子体反应器(10)最好使用一个分裂电极(26),该电极围绕反应器的等离子体圆顶(17)区域,并由选自VHF和UHF的高频能量驱动,并在反应器内部产生一个平行于电场的电场。晶片支撑电极(32c)。可以使用垂直于电场的静态轴向磁场。上述设备在真空室(16)内产生高密度,低能量的等离子体,以蚀刻金属,电介质和半导体材料。施加到晶片支撑阴极(32c)的相对较低的频率,优选地为RF频率,辅助偏置能量控制阴极鞘电压并且控制离子能量而与密度无关。公开了各种蚀刻工艺,沉积工艺和组合的蚀刻/沉积工艺(例如,溅射/小面沉积)。三极管(VHF / UHF分离电极加RF晶片支撑电极)可对敏感器件进行加工而不会造成损坏,并且不会产生微负载,从而提高了产量。 <图像>

著录项

  • 公开/公告号JP2543642B2

    专利类型

  • 公开/公告日1996-10-16

    原文格式PDF

  • 申请/专利权人 APPLIED MATERIALS INC;

    申请/专利号JP19920005826

  • 发明设计人 KENISU ESU KORINZU;

    申请日1992-01-16

  • 分类号B01J19/08;C23C14/54;C23F4/00;C30B25/02;C30B25/10;H01L21/3065;H01L21/31;H05H1/46;

  • 国家 JP

  • 入库时间 2022-08-22 03:59:46

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