首页> 外国专利> The ligneous junction board for the structural material junction in the wooden building and component null for structure

The ligneous junction board for the structural material junction in the wooden building and component null for structure

机译:木质建筑中木质材料连接的木质连接板,结构零组件

摘要

PURPOSE: To improve the execution properties, strength and resistance to fire of a woody cmenting plate and prevent the generation of condensation by impregnating a thin wood veneer with synthetic resin liquid, carrying out moisture conditioning properly, and then applying a bonding agent, making the fiber direction of veneer parallel or partly crossing and laminating. ;CONSTITUTION: A wood veneer such as rotary veneer or slice veer is impregnated with synthetic resin liquid of condensation type, addition polymerization type or water solution type, and the water content is moisture conditioned to 20-30%. The fiber direction of the veneer is made parallel or partly crossing and laminated by using a bonding agent. Then, a laminate is heat compressed to the proper thickness by a hot plate press. A cemented plate is formed by using a reinforced veneer laminating material thus manufactured, and a woody cemented plate 7 thus manufactured is fixed by a bolt 8 from the side face of, for instance, a joint 5 or a connection of a pillar or a beam 4. Also the strength can be improved by inserting a thin metal sheet of aluminum or the like or a fibrous reinforcing material or the like among the veneers impregnated with resin.;COPYRIGHT: (C)1994,JPO&Japio
机译:目的:为提高木质水泥胶合板的施工性能,强度和耐火性,并通过将薄木贴面用合成树脂液体浸渍,适当地进行湿气调理,然后再施加粘合剂,使胶合板成为单板的纤维方向平行或部分交叉和层压。组成:木质单板,例如旋转单板或切面单板,浸渍有缩合型,加成聚合型或水溶液型的合成树脂液体,含水量调节为20%至30%。通过使用粘合剂使单板的纤维方向平行或部分交叉并层压。然后,通过热板压机将层压板加热压缩至适当的厚度。通过使用这样制造的强化单板层压材料来形成胶合板,并且通过螺栓8从例如接头5的侧面或支柱或梁的连接处固定由此制造的木质胶合板7。 4.同样,通过在浸渍有树脂的胶合板之间插入铝等的金属薄板或纤维状的增强材料等,可以提高强度。COPYRIGHT:(C)1994,JPO&Japio

著录项

  • 公开/公告号JPH07110486B2

    专利类型

  • 公开/公告日1995-11-29

    原文格式PDF

  • 申请/专利权人 NARA PREFECTURE;

    申请/专利号JP19920076794

  • 发明设计人 KAWAI SHUICHI;NAKADA KINSAKU;

    申请日1992-03-31

  • 分类号B27M3/00;B27D5/00;E04B1/58;

  • 国家 JP

  • 入库时间 2022-08-22 03:58:55

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