PURPOSE:To improve the failure of peeling from the thermocompression bonding section (cutting of tape, not peeled, etc.) by changing the structure of the top sheet in the method of peeling the top sheet of an emboss carrier tape for electronic parts. CONSTITUTION:A top sheet where tape consisting of a film sheet layer A6 and tape consisting of a film sheet layer B8 and an adhesive layer B9 are worked by an adhesive layer A7 into a shape shown in the lamination figure is bonded by thermocompression with an emboss carrier by ironing method. In this instance, thermocompression bonding strength is determined so that the strength will be larger than that of the peeling strength of the adhesive layer A7. For the adhesion strength of the adhesive layer A7, a value from 20 to 30gr that is a lower limit range of a general peeling strength is selected. The top sheet 3 is peeled from the surface of the adhesive layer A7 on the mounting unit.
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