Packing device null of Seika

• 1. 精工螺钉自动包装钉盒机 [P] . 中国专利： CN210479202U . 2020.05.08
• 2. 一种机械精工用打磨装置 [P] . 中国专利： CN112372474B . 2021.12.31
• 3. Packing sack null for Seika thing freshness retention [P] . 日本专利： JP3024326B2 . 2000-03-21

  机译： 精制食品保鲜袋包装袋为空

• 4. Internal quality decision device and decision method null of Seika [P] . 日本专利： JP3481108B2 . 2003-12-22

  机译： 精工的内部品质决定装置及决定方法

• 5. Being packing manner of the belt condition component for the electrophotography device, packing manner of the nickel seamless exposure to light body belt for the electrophotography device and packing manner of the belt condition component for the packing mannered null electrophotography [P] . 日本专利： JP4476668B2 . 2010-06-09

  机译： 作为电子照相设备用带状条件部件的包装方式，电子照相设备用镍无缝暴露于光体带的包装方式以及用于包装的零电子照相用带状条件部件的包装方式。

• 1. Ultra-robust null convention logic circuit with emerging domain wall devices [C] . Yu Bai, Bo Hu, Weidong Kuang, ACM Great Lakes Symposium on VLSI . 2016
• 2. High-performance thermo-optic switch and electro-optic modulator based on polymeric multi-mode waveguides with high device packing density for optical network applications. [D] . Lu, Xuejun. 2001
• 3. Corneal Opacity in Lumican-Null Mice: Defects in Collagen Fibril Structure and Packing in the Posterior Stroma [O] . Shukti Chakravarti, W. Matthew Petroll, John R. Hassell, -1
• 4. Influence of intermolecular interactions of electron donating small molecules on their molecular packing and performance in organic electronic devices [O] . Kim, Ki-Hyun, Yu, Hojeong, Kang, Hyunbum, 2014
• 5. Kaju seigyoshiki hoko hojo sochi. Iryo fukushi kiki gijutsu kenkyu kaihatsu seika hokokusho. (Load controlling walk aiding apparatus. Report on results of research and development on medical and welfare device technologies). [R] . 1996

• 1. 基于性能的设计：NULL，还是NOT NULL？ [J] . Michelle A.Poolet ,贾笑明（译） . Windows IT Pro Magazine： 国际中文版 . 2007,第009期
• 2. Analog Devices公司 Devices EVAL—ADICUP360开发板 [J] . . 现代制造 . 2016,第016期
• 3. Enhanced Efficiency and Durability of Organic Electroluminescent Devices by Doping in Emitting LayerEnhanced Efficiency and Durability of Organic Electroluminescent Devices by Doping in Emitting Layer [J] . HUANGJing－song ,LIChuan－nan ,等 . 半导体光子学与技术：英文版 . 1999,第3期
• 4. N-d维广义Brownian单的像集一致Packing测度和一致Packing维数(英文) [J] . 徐赐文 ,闫海峰 ,黄贤玲 . 应用数学 . 2000,第3期
• 5. 概率空间（Ω,f,μ）中关于μ的packing维数与经典的实直线上的packing维... [J] . 戴朝寿 . 数学杂志 . 1995,第004期
• 6. 中国包装机械和机械产品包装 [C] . 许占林 ,肖衡 ,居荣华 . 2006年世界包装大会 . 2006
• 7. 中国--东盟食品加工与包装机械采购对接会汉英交替传译实践报告 [A] . 黄麟珏 . 2020