THERMALLY CONDUCTIVE MATERIAL AND ITS PRODUCTION, METHOD FOR COOLING ELECTRONIC PART, METHOD FOR COOLING CIRCUIT BOARD, AND METHOD FOR MOUNTING ELECTRONIC PART

摘要

PURPOSE: To produce a material which has a high persistent stable thermal conductivity and can realize tight adhesion at ordinary temperature and to provide a method for cooling electronic parts by which electronic parts or a circuit board can be cooled at high efficiency and a method for cooling a circuit board. ;CONSTITUTION: A method for cooling electronic parts 32 that form an electric circuit or for cooling a circuit board 10 having a plurality of electronic parts 32 mounted thereon, wherein the electronic parts 32 or the circuit board 10 is connected to a cooling device 36 via a thermally conductive material 38 containing both a metal or alloy and an organic material that are liquid at ordinary temperature so that the electronic parts 32 or the circuit board 10 is cooled by means of the cooling device 36.;COPYRIGHT: (C)1996,JPO