PROCESS AND DEVICE FOR THE STRIP MOUNTING OF SMT CAPABLE SEMICONDUCTOR CHIPS AND AN SMD BOARD MOUNTED THEREBY.

摘要

A PROCESS AND A DEVICE FOR THE STRIP MOUNTING OF SMT-CAPABLE SEMICONDUCTOR CHIPS (1), WHICH HAVE RIBBON CONTACTS (2) LED ON THEIR SURFACE UP TO THE CHIP EDGE AND ARE APPLIED ALREADY SEPARATED IN THE WAFER MATRIX TO A SELF-ADHESIVE FOIL (6),IS INTENDED TO ENABLE AUTOMATED MOUNTING OF THE SEMICONDUCTOR CHIPS (1) ON AN SMD PRINTED CONDUCTOR BOARD. AN ADHESIVE LAYER (4) IS APPLIED SELECTIVELY TO A FOIL TAPE (3), AND THE SEMICONDUCTOR CHIPS (1) ARE DETACHED SEQUENTIALLY FROM THE SELF-ADHESIVE FOIL (6), APPLIED AT DEFINED SEPARATIONS TO THE FOIL TAPE AND BONDED THERETO.THE METHOD ACCORDING TO THE INVENTION AND THE DEVICE ARE APPLIED IN SMD CHIP MOUNTING.(FIG. 1)