Pressure sensor with hermetically sealed stress separation platform to protect sensor die

摘要

The electronic pressure sensor 10 is enhanced by attaching the sensor die 18 to the stress separation platform 12 using an adhesive 42 having a similar coefficient of thermal expansion. The adhesive provides a sealing seal between the stress separation platform and the pressure sensor die.;The vias 20 in the stress separation platform provide an opening for the pressure to be applied to the sensor die. The stress separation platform is attached to the plastic package body 16 via a semi-sensitive adhesive 40 to provide a stress separation portion and a sealing seal between the package body and the stress separation platform. Any hostile chemical entering the buyer contacts the exposed diaphragm 50 of the sensor die assisting the pressure against the piezoelectric network 52 to generate a representative electrical signal of the applied pressure and is sensitive to the interaction by the sealing seal. Away from the connection.