a base film of insulating quality; a metal wire which is exposed to the outer part of the card body and is fabricated on one side of the base film; a device hole which is formulated by eliminating the base film for the purpose of the metal wire being exposed; a semiconductor chip which is equipped on the metal wire exposed by the device hole; a slot exposing the axis of the metal wire by eliminating a base film of the device hole side; wires which connects a metal wire exposed by the slot with a bonding pads of a semiconductor chip; a package body formed by the molding method for the purpose of protecting the metal wire surface exposed by eliminating the semiconductor chip, wire and the base film.
展开▼
