A process for preventing the re - deposition of etching products on substrate surfaces during the tungsten - etch back process, in the production of highly integrated circuits

摘要

during the ru00fccku00e4tzung, the substrate by means of a substratrand arranged on halteringes against a cooled probenaufnehmer pressed.this haltering erfindungsgemu00e4u00df is modified so that the substratrand only locally by the ru00fcckstaufrei at these points to the ru00fccku00e4tzung released u00e4tzprodukten trained haltering is kept, so that the u00e4tzprodukte at stops vorbeistru00f6men and s. ielt outside the substrate surface are separated.