Bond interface for joining partly metallised glass or ceramic substrate

摘要

Borosilicate or ceramic substrate (1) with partly metallised interface side (2) is bonded to a three-dimensionally structured Si substrate (4), oxidised (3) on the interface side. The interfaces are sepd. from one another in the edge region by formation of a wedge-like opening with predetermined profile, so that each surface of the metallisation layer is a predetermined min. distance from the oxide-free surface of the Si substrate.