Brief description of embodiments of the housings has several compartments for encapsulation of circuits microelectronic.

摘要

The present invention relates to the manufacture of the body of hermetic boxes used for encapsulation of integrated circuits used in microelectronics. It consists in producing the body of the box by brazing a common wall 1 slid between two slots 5 and 6 milled into a rectangular frame 9 constituting the periphery of the box. This technology has the advantages of being of low cost, of allowing precise positioning of the common wall 1 and of leaving the choice of the metal of this wall independent of that of the periphery of the box. IMAGE