Semiconductor laser device including heat sink with PN junction

摘要

A semiconductor laser device includes a semiconductor laser chip 1 containing a diode having a polarity, a heat sink 32 on which the semiconductor laser chip is mounted at an interface of the semiconductor laser chip and the heat sink, the heat sink including a pn junction 15/16 generally parallel to the interface, and a block 3 on which the heat sink is mounted. The diode LD of the semiconductor laser chip and the pn junction are electrically connected in parallel and in opposite polarity so that the pn junction of the heat sink 32 functions as a reverse current blocking diode for the semiconductor laser chip. In other arrangements, a plurality of heat sinks is provided in a stack and the laser and heat sink with pn junction may be a unitary body.