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Semiconductor substrate having wiring conductors at a first main surface electrically connected to plural pins at a second main surface
Semiconductor substrate having wiring conductors at a first main surface electrically connected to plural pins at a second main surface
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机译:具有在第一主表面上的布线导体的半导体衬底,该布线导体在第二主表面上电连接到多个引脚
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摘要
A semiconductor device includes a semiconductor substrate having a pair of opposed main surfaces with a wiring conductor provided on one of the main surfaces; the substrate having at least one through hole extending therethrough so as to be perpendicular to the main surfaces; at least one electrically conductive pin provided on the other of the main surfaces at a position of the at least one through hole, and an adhesive filled into the at least one through hole for fixing the at least one conductive pin to the substrate, wherein the at least one conductive pin is connected electrically through the corresponding at least one through hole to the wiring conductor to transmit/receive an electrical signal to/from an external circuit.
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