Method for modeling interactions in multilayered electronic packaging structures

摘要

A method for analyzing interactions between signal traces/vias and ground/power planes in multilayered electronic packaging structures is featured. The structure is provided with at least two, spaced-apart, conductive (generally metallic) planes, a conductive signal trace interposed between and coplanar with the spaced-apart conductive planes, and a via connected to the signal trace. Current that is assumed to be flowing in the via and signal trace is decomposed into two component currents called "modes". The first mode corresponds to a current which induces an electromagnetic field, resulting in an equal potential between the two conductive planes surrounding the signal trace. The second mode is the current which induces an electromagnetic field, resulting in a different voltage potential between the two surrounding conductive planes. The induced voltage in the signal trace/via due to the potential difference between conductive planes, together with the second mode via current that generates radial propagation of the potential difference between conductive planes efficiently and automatically accounts for all interactive effects of interplanar voltages and via/trace currents.