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High density, high speed, semiconductor interconnect using- multilayer flexible substrate with unsupported central portion
High density, high speed, semiconductor interconnect using- multilayer flexible substrate with unsupported central portion
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机译:高密度,高速,半导体互连,使用具有不支撑中心部分的多层柔性基板
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摘要
An interconnect structure formed of a flexible, multilayer dielectric material such as polyimide, having a support ring, connection points on the section inside the support ring for connecting one or more semiconductor chips, and connection points outside the support ring for connecting to a circuit board. Alignment templates are disclosed which align the semiconductor chip with the connection points.
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