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Method and structure for balancing encapsulation stresses in a hybrid circuit assembly
Method and structure for balancing encapsulation stresses in a hybrid circuit assembly
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机译:用于平衡混合电路组件中的封装应力的方法和结构
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摘要
A method and a structure for reducing the stresses arising in a hybrid circuit from the interface between the encapsulant and the substrate. An additional layer, preferably of the same material as the substrate, is added to the outside surface of the encapsulant. The purpose of the layer is to provide a second opposing surface to balance and thereby reduce the stress originating from the encapsulant/substrate interface. The second layer is applied prior to the curing of the encapsulant material.
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