首页>
外国专利>
Techniques for mounting semiconductor dies in die-receiving areas having support structure having notches
Techniques for mounting semiconductor dies in die-receiving areas having support structure having notches
展开▼
机译:在具有带有凹口的支撑结构的芯片接收区域中安装半导体芯片的技术
展开▼
页面导航
摘要
著录项
相似文献
摘要
In cases where there are at least some large gaps between edges of a semiconductor die and the inner ends of package conductors defining a die- receiving area, one or more bond wire support structure are disposed in the gap, thereby causing a long bond wire to behave as two or more shorter bond wires. The bond wires are tacked to a top surface of the support structure by various alternative means. Alternatively, a "jumper" structure having conductive traces of graduated length can be disposed in the die-receiving area between the die and the edges of the die-receiving area, providing an intermediate connection between the die and the leads of the package, thereby permitting short bond wires to be used in lieu of long bond wires.
展开▼