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TEMPERATURE PROFILE DISPLAYING METHOD OF REFLOW SOLDERING DEVICE
TEMPERATURE PROFILE DISPLAYING METHOD OF REFLOW SOLDERING DEVICE
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机译:回流焊装置的温度曲线显示方法
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摘要
PROBLEM TO BE SOLVED: To enable a display of a board temperature profile measured by temperature sensors mounted on the substrate to be corrected and easily viewed. ;SOLUTION: An inlet sensor 21 detects the tail side 3a of a substrate 3 introduced into an oven 2 as placed on a conveyer 4 and starts measuring the temperature of the substrate. Even if the conveyer 4 is varied in traveling speed by a regulator, an accurate distance from the inlet sensor 21 to the side 3a of the substrate 3 in an oven is measured by the number of pulses counted by a pulse counter 25 which operates synchronously with the conveyer 4. Distances 51, 52, and 53 from the side 3a of the substrate 3 to thermocouples 41, 42, and 43 are previously inputted as separate corrections into the memory of a computer and added to the measured values by the pulse counter 25 for correction. By this setup, the accurate distances of the thermocouples 41, 42, and 43 on the conveyer 4 from an inlet sensor 21 as a starting point are detected constantly, the channel positions of the thermocouples 41, 42, and 43 are corrected to positions on the conveyer 4, whereby the clear plotted figure of a temperature profile can be displayed.;COPYRIGHT: (C)1997,JPO
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