首页> 外国专利> REDUCTION OF RELATIVE PERMITTIVITY OF POLYMER THIN FILM AND FORMATION OF INTERLAMINAR INSULATING FILM

REDUCTION OF RELATIVE PERMITTIVITY OF POLYMER THIN FILM AND FORMATION OF INTERLAMINAR INSULATING FILM

机译:聚合物薄膜的相对介电常数的降低和层间绝缘膜的形成

摘要

PROBLEM TO BE SOLVED: To provide methods for forming both a polymer thin film having stable characteristics and an interlayer insulating film in a simple process. ;SOLUTION: A diamine and a diisocyanate as raw material monomers are evaporated in a vacuum to carry out the vapor deposition polymerization thereof on a substrate to form a low-molecular weight polyurea film, which is then irradiated with ultraviolet rays and heat-treated to perform cross-linking reaction and provide a high molecular weight. Thereby, the relative permittivity of the polyurea film is reduced. 4,4'-Diaminodiphenylmethane(MDA) is used as the diamine and 4,4'-diphenylmethane diisocyanate(MDI) is used as the diisocyanate. As a result, the relative permittivity of an interlayer insulating film 23 can be reduced to 3.08.;COPYRIGHT: (C)1997,JPO
机译:解决的问题:提供以简单的方法形成具有稳定特性的聚合物薄膜和层间绝缘膜的方法。 ;解决方案:将二胺和二异氰酸酯作为原料单体在真空中蒸发,使其在基材上进行气相沉积聚合,形成低分子量聚脲膜,然后用紫外线照射并进行热处理,进行交联反应并提供高分子量。由此,降低了聚脲膜的相对介电常数。 4,4'-二氨基二苯基甲烷(MDA)用作二胺,而4,4'-二苯基甲烷二异氰酸酯(MDI)用作二异氰酸酯。结果,可以将层间绝缘膜23的相对介电常数降低到3.08 。;版权所有:(C)1997,JPO

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