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REDUCTION OF RELATIVE PERMITTIVITY OF POLYMER THIN FILM AND FORMATION OF INTERLAMINAR INSULATING FILM
REDUCTION OF RELATIVE PERMITTIVITY OF POLYMER THIN FILM AND FORMATION OF INTERLAMINAR INSULATING FILM
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机译:聚合物薄膜的相对介电常数的降低和层间绝缘膜的形成
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摘要
PROBLEM TO BE SOLVED: To provide methods for forming both a polymer thin film having stable characteristics and an interlayer insulating film in a simple process. ;SOLUTION: A diamine and a diisocyanate as raw material monomers are evaporated in a vacuum to carry out the vapor deposition polymerization thereof on a substrate to form a low-molecular weight polyurea film, which is then irradiated with ultraviolet rays and heat-treated to perform cross-linking reaction and provide a high molecular weight. Thereby, the relative permittivity of the polyurea film is reduced. 4,4'-Diaminodiphenylmethane(MDA) is used as the diamine and 4,4'-diphenylmethane diisocyanate(MDI) is used as the diisocyanate. As a result, the relative permittivity of an interlayer insulating film 23 can be reduced to 3.08.;COPYRIGHT: (C)1997,JPO
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