首页> 外国专利> METHOD FOR ELECTROGALVANIZING METALLIC STRIP IN ELECTROLYTIC BATH OF CHLORIDE BASE FOR OBTAINING FILM HAVING SMALL ROUGHNESS AT HIGH ELECTRIC DENSITY

METHOD FOR ELECTROGALVANIZING METALLIC STRIP IN ELECTROLYTIC BATH OF CHLORIDE BASE FOR OBTAINING FILM HAVING SMALL ROUGHNESS AT HIGH ELECTRIC DENSITY

机译:在高电密度下获得具有小粗糙度的薄膜的氯化物碱电解槽中金属镀锌的方法

摘要

PROBLEM TO BE SOLVED: To control the plating surface phase in high-current plating and further to prevent the precipitation of dendrite crystals at the edges of a strip by controlling the relative velocity of the strip and the electrolytic solution and current density at the time of continuously galvanizing the metallic strip in an electrolytic bath of a chloride base circulated by using a radial type electrolytic cell. ;SOLUTION: The current density J is specified to ≥50A/dm2, J/Jlim to ≤0.15 and J2/Jlim to ≤22A/dm2 at the time of subjecting the traveling material strip to plating while the electrolytic bath of the chloride base is passed at the relative velocity V in the spacing between the strip and cathode. The Jlim referred to here in the threshold current density corresponding to the horizontal part of the current density of the 'current-potential' characteristic curve of the electrolytic bath flowing at the velocity V near the metallic strip. The Jlim is determined by Jlim-AxV. The coefft. A in the equation dependent upon the compsn., temp. and viscosity of the electrolytic bath is empirically determined by Levi-Civita line method.;COPYRIGHT: (C)1997,JPO
机译:解决的问题:控制大电流镀覆中的镀层表面相,并通过控制铸带时电解液的相对速度和电解液浓度以及电流密度,来防止树枝状晶体沉淀在铸带边缘。在使用径向型电解池循环的氯化物碱的电解槽中连续镀锌金属带。 ;解决方案:电流密度J指定为≥50A/ dm 2 ,J / Jlim为≤0.15和J 2 / Jlim为≤22A/ dm 2 在使氯化物碱的电解浴以相对速度V在带材和阴极之间的距离通过的同时,对行进材料带材进行电镀时。在此,在阈值电流密度中所指的Jlim对应于以接近金属带的速度V流动的电解浴的“电流-电位”特性曲线的电流密度的水平部分。 Jlim由Jlim-AxV确定。系数。等式中的A取决于压缩温度。电解槽的粘度由Levi-Civita线法确定。;版权所有:(C)1997,日本特许厅

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