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INTERFACE STATE DENSITY MEASUREMENT, INTERFACE STATE DENSITY MEASURING DEVICE AND STANDARD SAMPLE FOR MEASUREMENT

机译:界面状态密度测量,界面状态密度测量设备和标准样品

摘要

PURPOSE: To measure the interface state density of a silicon substrate in a non-processed, non-contact way. ;CONSTITUTION: The interface state density of a silicon substrate to be measured is found from the proportional constant between the value of the second power of the reciprocal of the thickness of the silicon substrate and the value of the reciprocal of the carrier life time, on the basis of correspondence of the proportional constant between the value of the second power of the reciprocal of the thickness of the silicon substrate and the value of the reciprocal of the carrier life time with the interface state density of the silicon substrate. By thus measuring the interface state density of the silicon substrate using microwave photoconductive attenuation, in-line measurement can be easily carried out without being affected by an electrode forming process, back-side ohmic processing and contamination of a sample due to contact with an electrode. Also, the costs for quality check in manufacturing device and processes can be reduced.;COPYRIGHT: (C)1996,JPO
机译:目的:以未经处理的非接触方式测量硅基板的界面态密度。 ;组成:要测量的硅衬底的界面态密度是由硅衬底的厚度的倒数的二次方的值与载流子寿命的倒数的值之间的比例常数求得的。硅衬底的厚度的倒数的二次方的值与载流子寿命的倒数的值与硅衬底的界面态密度之间的比例常数的对应关系的基础。通过使用微波光导衰减法这样测量硅基板的界面状态密度,可以容易地进行在线测量而不受电极形成工艺,背面欧姆处理和由于与电极接触而引起的样品污染的影响。 。而且,可以减少制造设备和过程中的质量检查成本。;版权所有:(C)1996,日本特许厅

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