WIRE LAYING CHIP FOR DOUBLE FLOOR AND WIRE LAYING CONSTRUCTION FOR FLOOR PANEL USING THE CHIP

摘要

PURPOSE: To obtain wire laying chips for double floor capable of performing wire laying to a good form and a wire laying construction for floor panel using the chips while adopting a simple construction without using a rotatable construction relative to the floor panel. ;CONSTITUTION: A wire laying chip 1 for double floor comprises a cylindrical drum portion 2 having linking projections 2a at predetermined positions in axial direction, and a head portion 3 having a knock-out portion 3a for forming a wire laying hole at the center, which has an outer diameter larger than that of the drum portion and is connected to close its opening at the end portion of the drum portion. These are all made of an elastic material. At the drum portion 2 and the head portion 3, notches S2 and S3 formed by partially leaving are continuously provided on a line passing through the wire laying hole formed by punching the knock-out portion 3a. Also, the wire laying construction of the floor panel is constituted by an almost rectangular plate-shaped floor panel having this wire laying chip 1 and a wire laying opening portion.;COPYRIGHT: (C)1996,JPO