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Punched-out device and punched-out manner null of girder body attaching

机译:箱梁体的冲出装置及冲出方式为零

摘要

PURPOSE: To precisely punch the lead of electronic part having the guard body for guarding the lead. ;CONSTITUTION: A lower die 26 is moved between a receiving position (a) of an electronic part 100, a punching position (b) and a delivering position (c) to a transferring head 1. An upper die 45 which punches a lead 102 is provided freely movable against the lower die 26 at the upper side of the punching position (b). When the upper die 45 is lowered, a pilot pin 47 made by one body with the upper die 47 is advanced into a pin hole 28 of the lower die 28, at this time, the positioning of the punch 55 of the upper die 45 with the die 27 of the lower die 26 is executed by moving the upper die 45 and the lead 102 is precisely cut with the punch 55 and the die 27. Next, the lower die 26 is moved to the delivering position c, the transferring head 1 picks up the electronic part 100 on the lower die 26, transports and mounts to the base plate 4.;COPYRIGHT: (C)1993,JPO&Japio
机译:用途:精确冲压具有防护罩的电子零件的引线,以保护引线。组成:下模26在电子零件100的接收位置(a),打孔位置(b)和到传送头1的传送位置(c)之间移动。上模45对引线102进行打孔在冲孔位置(b)的上侧设置有可相对于下模26自由移动的装置。当上模具45下降时,由一个主体与上模具47制成的导向销47前进到下模具28的销孔28中,此时,上模具45的冲头55的定位与通过移动上模具45来执行下模具26的模具27,并且用冲头55和模具27精确地切割引线102。接着,下模具26移动到输送位置c,即转移头1。在下模26上拾取电子零件100,运输并安装到基板4。;版权所有:(C)1993,JPO&Japio

著录项

  • 公开/公告号JP2646942B2

    专利类型

  • 公开/公告日1997-08-27

    原文格式PDF

  • 申请/专利权人 MATSUSHITA DENKI SANGYO KK;

    申请/专利号JP19920211096

  • 发明设计人 KASHIWAGI YASUHIRO;

    申请日1992-08-07

  • 分类号B21D28/00;H01L23/50;

  • 国家 JP

  • 入库时间 2022-08-22 03:30:07

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