Aging methods and aging for the power supply board and aging equipment of semiconductor device

摘要

PURPOSE:To perform collectively the aging of many semiconductor devices at the state of each wafer before its wafer is divided into chips by feeding a power source and signal voltage after using a feeding board and then, making IC chips operate. CONSTITUTION:A feeding electrode 9 is disposed at the same position as the electrode position of chips which are formed on a wafer 1 and a current control resistor 3 connecting to the electrode 9 is provided. Further, the surface of the feeding electrode of a feeding board 15 consisting of materials which have the same thermal expansion coefficient as that of the wafer 16 or have a thermal expansion coefficient that is close to that of the wafer 16 faces the electrode surface of the IC chips that are formed on the wafer 16 and alignment between feeding and chip electrodes is performed. Further, both feeding and chip electrodes are connected by a press-fixing means 18 and the power source and signal voltage are fed to the IC chips located on the wafer 16 by the feeding board 15. Aging is performed collectively at the state of each wafer before its wafer is divided into the chips after making the IC chips operate.