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The support component for the electronic package assembly body and the electronic package assembly body null which uses
The support component for the electronic package assembly body and the electronic package assembly body null which uses
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机译:用于电子封装组件本体的支撑部件和使用的电子封装组件本体null
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摘要
PURPOSE: To protect an electronic component from a pressure given by a heat- dissipating member by a method wherein, when a heat-dissipating plate is attached to the top surface of the electronic component and the lower end of the lower leg of the heat-dissipating plate is placed on a board, a gap is formed between the top surface of the board and the bottom surface of the heat-dissipating plate. ;CONSTITUTION: Cylindrical lower legs 11 are installed at the rear surface of a heat-dissipating plate 12, and cylindrical upper legs 13 are installed at the surface. Then, the lower legs 11 are inserted into holes in a tape carrier 20, and their lower ends are fixed to a board 42 by solder 111. At this time, an LSI chip 40 is bonded to the rear surface of the heat-dissipating plate 12 by an adhesive 44. On the other hand, the upper legs 13 are inserted into holes 431 in a heat sink 43 which is installed at the surface of the heat-dissipating plate 12 so as to be tightened and fixed by knuts 47. In this manner, a gap is formed between the surface of the board 42 and the rear surface of the heat- dissipating plate 12. Thereby, it is possible to protect the LSI chip 40 from a pressure given by the heat sink 43.;COPYRIGHT: (C)1996,JPO
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