Contains brominated epoxy compound and the same chemical compound the difficult thermalization resin constituent

摘要

NEW MATERIAL:The brominated epoxy compound of formula I (number-average of n is 2-10). USE:It has excellent thermal stability and is useful as a flame-retardant for various resins, a component for resin composition having excellent flame- retardance and thermal stability and a component for flame-retardant epoxy resin composition having excellent moisture resistance and thermal stability, low content of bromine extractable with hot water and useful for the sealing of semiconductor. The flame-retardant epoxy resin for semiconductor sealing is produced by using 3-30wt.% of the brominated epoxy compound of formula I based on the epoxy resin to be made flame-retardant. PREPARATION:The objective compound of formula I can be produced by epoxidizing a brominated polycarbonate oligomer of formula II with an epihalohydrin in the presence of an alkali metal hydroxide under normal pressure at 80-105 deg.C or under reduced pressure at about 50-80 deg.C.