Brominated epoxy compound and resistance to flame conversion epoxy resin constituent null for semiconductor seal

摘要

PURPOSE:To obtain a brominated epoxy compound suitable as a flame-retardant for resins, having excellent thermal stability by reacting a specific bisphenol type epoxy resin with a specific brominated polycarbonate oligomer in a specific ratio. CONSTITUTION:A bisphenol type epoxy resin (e.g. 4,4'-dihydroxybiphenyl) shown by formula I (X1 and X2 are H, halogen or 1-5C alkyl; m is 0-5) is reacted with a brominated polycarbonate oligomer shown by formula II (n is 1-10) containing a phenolic hydroxyl group at the end in a ratio of 0.05-0.5 phenolic hydroxyl group of the oligomer based on 1 epoxy group of the epoxy resin to give a brominated epoxy compound. 100 pts.wt. epoxy resin is blended with 3-50 pts.wt. of the compound to give an epoxy resin composition suitable for sealing semiconductors, providing cured materials having a small amount of extractable bromine content, excellent thermal stability and flame retardance.